公开(公告)号：US11355469B2

公开(公告)日：2022-06-07

申请号：US16957568

申请日：2018-12-27

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Takahiro Fukui ,  Shinnosuke Iwamoto

IPC: H01L23/00

Abstract: One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

公开(公告)号：US12134720B2

公开(公告)日：2024-11-05

申请号：US16957538

申请日：2018-12-27

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Shinnosuke Iwamoto ,  Takahiro Fukui

IPC: C09J9/02 ,  B32B15/08 ,  B32B15/20 ,  C09J7/28 ,  C09J11/04 ,  H01B1/22 ,  H01B5/00

Abstract: One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.

公开(公告)号：US11414573B2

公开(公告)日：2022-08-16

申请号：US16328944

申请日：2017-08-29

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Satoru Matsumoto ,  Yusuke Asakawa ,  Tatsuya Kumada ,  Takahiro Fukui

IPC: C09J9/02 ,  C09J201/00 ,  C09J163/00 ,  C09J7/00 ,  C09J175/16

Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

公开(公告)号：US11242472B2

公开(公告)日：2022-02-08

申请号：US16486522

申请日：2018-02-14

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Hiroyuki Izawa ,  Takahiro Fukui ,  Tatsuya Kumada

IPC: C09J9/02 ,  C08K3/08 ,  C09J11/04 ,  C09J201/00

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.