Invention Grant
- Patent Title: Photonic devices integrated with reflectors
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Application No.: US16817582Application Date: 2020-03-12
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Publication No.: US11243350B2Publication Date: 2022-02-08
- Inventor: Yusheng Bian , Bo Peng , Michal Rakowski
- Applicant: GLOBALFOUNDRIES U.S. INC.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. INC.
- Current Assignee: GLOBALFOUNDRIES U.S. INC.
- Current Assignee Address: US CA Santa Clara
- Agent David Cain
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/12

Abstract:
The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.
Public/Granted literature
- US20210286130A1 PHOTONIC DEVICES INTEGRATED WITH REFLECTORS Public/Granted day:2021-09-16
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