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    THERMAL STABILIZATION CIRCUIT FOR AN OPTICAL RING RESONATOR
    2.
    发明公开
    THERMAL STABILIZATION CIRCUIT FOR AN OPTICAL RING RESONATOR 审中-公开

    公开(公告)号：US20230341627A1

    公开(公告)日：2023-10-26

    申请号：US17729031

    申请日：2022-04-26

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Michal Rakowski ,  Vaibhav A. Ruparelia ,  Riddhi Nandi ,  Prateek K. Sharma ,  Avijit Chatterjee ,  Vasudeva Reddy KuppiReddy ,  Indranil Som

    IPC: G02B6/293 ,  G02B6/12

    CPC classification number: G02B6/2934 ,  G02B6/12026 ,  G02F2201/58 ,  H01S3/083

    Abstract: Disclosed is a thermal stabilization circuit including a heater, which is adjacent and thermally coupled to a closed-curve waveguide of an optical ring resonator, and an analog feedback circuit, which includes a fully autonomous analog feedback loop from a drop port of a bus waveguide of the optical ring resonator to the heater. This analog feedback circuit is configured to dynamically control the electrical power provided to the heater and, thereby to dynamically control the thermal output of the heater in order to tune the ring resonance wavelength to the operating laser wavelength. The analog feedback circuit is further configured to be independent of input power, to be power efficient, to have a relatively small footprint, to have a tunable time constant and to facilitate adjustable wavelength locking. Also disclosed is a device (e.g., a ring-based transceiver or the like), which includes multiple optical ring resonators and corresponding thermal stabilization circuits.

    Light coupling between stacked photonics chips
    8.
    发明授权
    Light coupling between stacked photonics chips 有权

    公开(公告)号：US12001056B2

    公开(公告)日：2024-06-04

    申请号：US17834375

    申请日：2022-06-07

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Bartlomiej Jan Pawlak ,  Michal Rakowski ,  Yusheng Bian

    IPC: G02B6/293 ,  G02B6/42

    CPC classification number: G02B6/2934 ,  G02B6/4215

    Abstract: Structures including stacked photonics chips and methods of fabricating a structure including stacked photonics chips. The structure comprises a first chip including a first waveguide core, a ring resonator adjacent to a portion of the first waveguide core, and a first dielectric layer over the first waveguide core and the ring resonator. The first dielectric layer has a first surface. The structure further comprises a second chip including a second waveguide core and a second dielectric layer over the second waveguide core. The second dielectric layer has a second surface adjacent to the first surface of the first dielectric layer, and the second waveguide core is positioned adjacent to the ring resonator.

    OPTICAL RING RESONATOR-BASED MICROFLUIDIC SENSOR
    9.
    发明公开
    OPTICAL RING RESONATOR-BASED MICROFLUIDIC SENSOR 审中-公开

    公开(公告)号：US20230288321A1

    公开(公告)日：2023-09-14

    申请号：US17689120

    申请日：2022-03-08

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Bartlomiej J. Pawlak ,  Michal Rakowski

    IPC: G01N21/31 ,  G02B6/293

    CPC classification number: G01N21/31 ,  G02B6/29343 ,  G02B6/2935

    Abstract: Disclosed is a structure (e.g., a lab-on-chip structure) including a substrate, an insulator layer on the substrate, and at least one optical ring resonator. Each ring resonator includes cladding material on the insulator layer and, embedded within the cladding material, a first waveguide core with an input and an output, and second waveguide core(s) (e.g., ring waveguide core(s)) positioned laterally adjacent to the first waveguide core. A reservoir is below the ring resonator within the insulator layer and substrate such that surfaces of the waveguide cores are exposed within the reservoir. During a sensing operation, the waveguide core surfaces contact with fluid within the reservoir and a light signal at the output of the first waveguide core is monitored (e.g., by a sensing circuit, which in some embodiments is also coupled to a reference optical ring resonator) and used, for example, for spectrum-based target identification and, optionally, characterization.

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