Invention Grant
- Patent Title: Substrate transfer device and substrate transfer method
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Application No.: US16574285Application Date: 2019-09-18
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Publication No.: US11244849B2Publication Date: 2022-02-08
- Inventor: Katsuhiro Morikawa , Yuta Matsushima
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2016-117383 20160613,JP2016-117384 20160613
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; B25J11/00 ; H01L21/677
Abstract:
Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.
Public/Granted literature
- US20200013666A1 SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD Public/Granted day:2020-01-09
Information query
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