公开(公告)号：US11600500B2

公开(公告)日：2023-03-07

申请号：US17371384

申请日：2021-07-09

Applicant: Tokyo Electron Limited

Inventor： Kouzou Tachibana ,  Katsuhiro Morikawa ,  Kouichi Mizunaga

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  B08B13/00 ,  H05B1/02 ,  H05B3/26 ,  B08B3/04

Abstract: A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.

公开(公告)号：US11244849B2

公开(公告)日：2022-02-08

申请号：US16574285

申请日：2019-09-18

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Yuta Matsushima

IPC: H01L21/687 ,  H01L21/67 ,  B25J11/00 ,  H01L21/677

Abstract: Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.

公开(公告)号：US10042356B2

公开(公告)日：2018-08-07

申请号：US14625201

申请日：2015-02-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naruaki Iida ,  Katsuhiro Morikawa

IPC: H01L21/677 ,  G05B19/418 ,  H01L21/687 ,  H01L21/68

Abstract: A substrate processing apparatus includes: first and second places in which a substrate can be placed; a substrate transfer device having a substrate holder that holds the substrate to transfer the substrate between the first and second places; and a substrate position measuring unit that detects a position of the substrate held by the substrate holder. The substrate position measuring unit, disposed independently of the substrate transfer device, is arranged at a position where the substrate held by the substrate holder of the substrate transfer device can be placed.

公开(公告)号：US09696262B2

公开(公告)日：2017-07-04

申请号：US14649615

申请日：2013-12-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Katsuhiro Morikawa ,  Ikuo Sunaka

IPC: G01N21/88 ,  H01L21/673 ,  H01L21/67 ,  H01L21/677

CPC classification number: G01N21/88 ,  H01L21/67265 ,  H01L21/67326 ,  H01L21/67346 ,  H01L21/67733 ,  H01L21/67772 ,  H01L21/67775

Abstract: A substrate processing apparatus includes: a load port into which the transport container is carried; a detecting unit that detects storage condition of the substrates which are contained in the transport container, which has been carried into the load port and the lid of which has been removed; a processing unit that processes the substrates removed from the transport container having been carried into the load port; and a control unit. The control unit performs a first step that detects storage condition of the substrates, which are contained in the transport container having been carried into the load port, before the substrates are removed from the transport container to be delivered to the processing unit; a second step that detects storage condition of the substrates, which have been processed in the processing unit and returned to the original transport container, before closing the lid; and a third step that judges whether or not the transport container has an abnormality based on results of the first and second steps.

公开(公告)号：US20170178935A1

公开(公告)日：2017-06-22

申请号：US15448882

申请日：2017-03-03

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Ikuo Sunaka ,  Seiji Nakano ,  Kazunori Kuratomi ,  Toshio Shimazu

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67265 ,  B65G2201/0297 ,  H01L21/67772 ,  H01L21/67778

Abstract: A substrate transfer method is provided. The substrate transfer method comprises: loading the transfer container to a load port, and separating the cover body from the container main body; detecting an accommodation status of the substrate in the container main body by a detection unit; correcting, by a correction device, the accommodation status of the substrate in the container main body in which the accommodation status of the substrate detected by the detection unit is abnormal; and allowing a substrate transfer device to enter the container main body in which the accommodation status of the substrate is corrected, and unloading the substrate from the container main body.

公开(公告)号：US20140178162A1

公开(公告)日：2014-06-26

申请号：US14135988

申请日：2013-12-20

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Ikuo Sunaka ,  Seiji Nakano ,  Kazunori Kuratomi ,  Toshio Shimazu

IPC: H01L21/677

CPC classification number: H01L21/67265 ,  B65G2201/0297 ,  H01L21/67772 ,  H01L21/67778

Abstract: A substrate transfer apparatus unloads a substrate from a transfer container in which a cover body airtightly closes a substrate unloading opening formed at a front surface of a container main body and multiple substrates are accommodated in the form of shelves. The substrate transfer apparatus includes a load port to which the transfer container is loaded; a detection unit configured to detect an accommodation status of the substrate in the container main body that is loaded to the load port and separated from the cover body; a substrate transfer device configured to enter the container main body and unload the substrate; and a correction device configured to correct the accommodation status of the substrate in the container main body before the substrate is unloaded from the container main body by the substrate transfer device when the detection unit detects abnormality in the accommodation status.

Abstract translation: 基板传送装置从其中盖体气密地封闭形成在容器主体的前表面的基板卸载开口的转印容器卸载基板，并且多个基板以架子的形式容纳。 基板输送装置包括装载转印容器的装载口， 检测单元，被配置为检测装载到所述负载端口并与所述盖体分离的所述容器主体中的所述基板的调节状态; 基板转印装置，被配置为进入所述容器主体并卸载所述基板; 以及校正装置，其被配置为当所述检测单元检测到所述调节状态中的异常时，通过所述基板传送装置从所述容器主体卸载所述基板之前的所述基板在所述容器主体中的调节状态。

公开(公告)号：US11551945B2

公开(公告)日：2023-01-10

申请号：US16583550

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Satoshi Morita ,  Kouichi Mizunaga

IPC: H01L21/67 ,  H01L21/304 ,  B08B3/04 ,  H01L21/02

Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.

公开(公告)号：US11532492B2

公开(公告)日：2022-12-20

申请号：US16830371

申请日：2020-03-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.

公开(公告)号：US20220154342A1

公开(公告)日：2022-05-19

申请号：US17598597

申请日：2020-03-24

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Mitsuaki Iwashita ,  Satoshi Kaneko

IPC: C23C18/16 ,  H01L21/288 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677 ,  C23C18/18

Abstract: A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

公开(公告)号：US11208725B2

公开(公告)日：2021-12-28

申请号：US16583628

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Kouichi Mizunaga ,  Masami Akimoto ,  Satoshi Morita ,  Katsuhiro Morikawa

IPC: C23C18/16 ,  H01L21/683 ,  H01L21/67 ,  B05C13/02

Abstract: A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.