Invention Grant
- Patent Title: Antenna module configurations
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Application No.: US16145100Application Date: 2018-09-27
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Publication No.: US11245175B2Publication Date: 2022-02-08
- Inventor: Seong Heon Jeong , Rajneesh Kumar , Mohammad Ali Tassoudji , Darryl Jessie , Gurkanwal Sahota , Kevin Hsi Huai Wang , Jeong Il Kim , Taesik Yang , Thomas Myers , Neil Burns , Julio Zegarra , Clinton James Wilber , Jordan Szabo
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01L25/065 ; H01L23/28 ; H01L23/552 ; H01L23/64 ; H01L23/66 ; H01Q1/52 ; H01Q9/06 ; H01Q9/26 ; H01Q21/28 ; H01L23/31 ; H01Q9/04

Abstract:
An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.
Public/Granted literature
- US20190103653A1 ANTENNA MODULE CONFIGURATIONS Public/Granted day:2019-04-04
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