Invention Grant
- Patent Title: Stage for cutting substrate that includes main stage and dummy stage, substrate-cutting device, and method of operating substrate-cutting device
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Application No.: US16273551Application Date: 2019-02-12
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Publication No.: US11247296B2Publication Date: 2022-02-15
- Inventor: Eunju Kim , Seoin Han
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0017964 20180213
- Main IPC: B23K26/142
- IPC: B23K26/142 ; H01L21/67 ; H01L27/32 ; H01L21/78 ; H01L51/56 ; H01L21/00 ; B23K103/00 ; B23K101/42
Abstract:
A substrate-cutting stage includes a main stage and a dummy stage spaced apart from each other with a cutting region interposed therebetween and that support a substrate. The main stage supports a first portion of the substrate, the dummy stage supports a second portion of the substrate, and the cutting region overlaps a to-be-cut portion of the substrate disposed between the first and second portions.
Public/Granted literature
- US20190247955A1 STAGE FOR CUTTING SUBSTRATE, SUBSTRATE-CUTTING DEVICE, AND METHOD OF OPERATING SUBSTRATE-CUTTING DEVICE Public/Granted day:2019-08-15
Information query
IPC分类:
