- 专利标题： Semiconductor wafer and method of probe testing
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申请号： US16656182申请日： 2019-10-17
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公开(公告)号： US11257724B2公开(公告)日： 2022-02-22
- 发明人: Michael J. Seddon
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Adam R. Stephenson, Ltd.
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L29/10 ; H01L21/66 ; H01L21/683 ; G01R31/28 ; H01L21/78 ; H01L21/304
摘要：
Implementations of methods of making a semiconductor device may include: providing a partial semiconductor wafer. The method may also include providing a wafer holder including a tape portion with one or more openings through the tape portion. The method may include mounting the partial semiconductor wafer over the one or more openings in the tape portion of the wafer holder and providing an electrical connection to the partial semiconductor wafer through the one or more openings in the tape portion during probe test.
公开/授权文献
- US20200051878A1 SEMICONDUCTOR WAFER AND METHOD OF PROBE TESTING 公开/授权日：2020-02-13
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