Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the device
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Application No.: US16723761Application Date: 2019-12-20
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Publication No.: US11257918B2Publication Date: 2022-02-22
- Inventor: Yusuke Kanda , Hideyuki Okita , Manabu Yanagihara , Takeshi Harada
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2017-133454 20170707
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/45 ; H01L21/285 ; H01L21/306 ; H01L29/20 ; H01L29/205 ; H01L29/66

Abstract:
A semiconductor device includes a substrate; a first nitride semiconductor layer above the substrate; a second nitride semiconductor layer on the first nitride semiconductor layer; an ohmic electrode above the substrate; and a contact layer in contact with at least a part of the ohmic electrode, the contact layer containing silicon and chlorine. The second nitride semiconductor layer has a wider band gap than the first nitride semiconductor layer. A two-dimensional electron gas channel is formed in the first nitride semiconductor layer at a heterointerface between the first nitride semiconductor layer and the second nitride semiconductor layer. A silicon concentration has a higher peak value than a chlorine concentration in the contact layer.
Information query
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