Invention Grant
- Patent Title: Circuit board using low dielectric resin composition
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Application No.: US17121616Application Date: 2020-12-14
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Publication No.: US11261328B2Publication Date: 2022-03-01
- Inventor: Szu-Hsiang Su , Shou-Jui Hsiang , Mao-Feng Hsu , Ming-Jaan Ho
- Applicant: Zhen Ding Technology Co., Ltd.
- Applicant Address: TW Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: ScienBiziP, P.C.
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08L51/00 ; C08J3/24 ; C08L51/08 ; H05K1/03 ; C08J5/18 ; H05K3/38

Abstract:
A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.
Public/Granted literature
- US20210102067A1 CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION Public/Granted day:2021-04-08
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