公开(公告)号：US11261328B2

公开(公告)日：2022-03-01

申请号：US17121616

申请日：2020-12-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/00 ,  C08J3/24 ,  C08L51/08 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

公开(公告)号：US11680138B2

公开(公告)日：2023-06-20

申请号：US17114988

申请日：2020-12-08

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Wei-Hsin Huang

IPC: C08G69/26 ,  C08L67/03 ,  C08G69/32 ,  C08J3/09 ,  C08J3/11 ,  C08J5/18

CPC classification number: C08G69/265 ,  C08G69/32 ,  C08J3/096 ,  C08J3/11 ,  C08J5/18 ,  C08L67/03 ,  C08K2201/005 ,  C08L2201/56 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/12 ,  C08L2312/00

Abstract: A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.

公开(公告)号：US11524491B2

公开(公告)日：2022-12-13

申请号：US17107787

申请日：2020-11-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Wei-Hsin Huang ,  Chi-Fei Huang ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Kuan-Wei Lee

IPC: B32B27/28 ,  B29C53/56 ,  B32B37/02 ,  B29C53/00 ,  B29C53/16 ,  B32B38/10 ,  B32B38/00 ,  B32B37/20 ,  B29K105/00 ,  C08G73/10 ,  B29K79/00 ,  C08G69/32

Abstract: A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

公开(公告)号：US10928730B2

公开(公告)日：2021-02-23

申请号：US16027327

申请日：2018-07-04

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Szu-Hsiang Su

IPC: G03F7/038 ,  G03F7/32 ,  C08G18/67 ,  C08F2/50 ,  C08F299/06 ,  G03F7/037

Abstract: A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.

公开(公告)号：US10894882B2

公开(公告)日：2021-01-19

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US11859038B2

公开(公告)日：2024-01-02

申请号：US16936204

申请日：2020-07-22

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Wei-Hsin Huang

IPC: C08J5/18 ,  C08F293/00

CPC classification number: C08F293/00 ,  C08J5/18 ,  C08J2377/06

Abstract: A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is




or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of





and intermediate groups selected from a chemical structural formula of





Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.

公开(公告)号：US11655366B2

公开(公告)日：2023-05-23

申请号：US17110950

申请日：2020-12-03

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Pei-Jung Wu ,  Szu-Hsiang Su ,  Shou-Jui Hsiang

IPC: C08L79/08 ,  C08G69/32 ,  C08G73/10 ,  C08K5/20 ,  C08K5/101 ,  C08K5/3415

CPC classification number: C08L79/08 ,  C08G69/32 ,  C08G73/1028 ,  C08K5/101 ,  C08K5/20 ,  C08K5/3415 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/20

Abstract: A transparent polyimide mixture is disclosed. The transparent polyimide mixture includes a transparent polyimide, an additive, and a solvent. A molecular chain of the transparent polyimide includes an active hydrogen atom. The additive includes a carbodiimide group. An equivalent ratio of the active hydrogen atom and the carbodiimide group is in a range of 1:0.8 to 1:1.2. A method for preparing the transparent polyimide mixture, a transparent polyimide film, and a method for preparing a transparent polyimide film are also disclosed.