公开(公告)号：US10329368B2

公开(公告)日：2019-06-25

申请号：US15484135

申请日：2017-04-11

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Mao-Feng Hsu ,  Chen-Feng Yen ,  Shou-Jui Hsiang ,  Yen-Chin Hsiao

IPC: C08F220/32 ,  G03F7/029 ,  G03F7/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/06 ,  C08F2/48 ,  G03F7/027 ,  G03F7/031 ,  H05K3/28

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

公开(公告)号：US11859038B2

公开(公告)日：2024-01-02

申请号：US16936204

申请日：2020-07-22

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Wei-Hsin Huang

IPC: C08J5/18 ,  C08F293/00

CPC classification number: C08F293/00 ,  C08J5/18 ,  C08J2377/06

Abstract: A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is




or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of





and intermediate groups selected from a chemical structural formula of





Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.

公开(公告)号：US11655366B2

公开(公告)日：2023-05-23

申请号：US17110950

申请日：2020-12-03

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Kuan-Wei Lee ,  Pei-Jung Wu ,  Szu-Hsiang Su ,  Shou-Jui Hsiang

IPC: C08L79/08 ,  C08G69/32 ,  C08G73/10 ,  C08K5/20 ,  C08K5/101 ,  C08K5/3415

CPC classification number: C08L79/08 ,  C08G69/32 ,  C08G73/1028 ,  C08K5/101 ,  C08K5/20 ,  C08K5/3415 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/20

Abstract: A transparent polyimide mixture is disclosed. The transparent polyimide mixture includes a transparent polyimide, an additive, and a solvent. A molecular chain of the transparent polyimide includes an active hydrogen atom. The additive includes a carbodiimide group. An equivalent ratio of the active hydrogen atom and the carbodiimide group is in a range of 1:0.8 to 1:1.2. A method for preparing the transparent polyimide mixture, a transparent polyimide film, and a method for preparing a transparent polyimide film are also disclosed.

公开(公告)号：US10928730B2

公开(公告)日：2021-02-23

申请号：US16027327

申请日：2018-07-04

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Szu-Hsiang Su

IPC: G03F7/038 ,  G03F7/32 ,  C08G18/67 ,  C08F2/50 ,  C08F299/06 ,  G03F7/037

Abstract: A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.

公开(公告)号：US10894882B2

公开(公告)日：2021-01-19

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US10428238B2

公开(公告)日：2019-10-01

申请号：US15689166

申请日：2017-08-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

公开(公告)号：US10423069B2

公开(公告)日：2019-09-24

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Chang-Hung Lee ,  Yi-Fang Lin ,  Yen-Chin Hsiao ,  Shou-Jui Hsiang ,  Mao-Feng Hsu

IPC: G03F7/029 ,  H05K1/03 ,  C09D139/04 ,  C07D263/12 ,  C07D263/14 ,  C09D133/06 ,  G03F7/031 ,  G03F7/038 ,  G03F7/07 ,  H05K3/28 ,  H05K3/34

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

公开(公告)号：US11602921B2

公开(公告)日：2023-03-14

申请号：US16511222

申请日：2019-07-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chi-Fei Huang ,  Sheng-Feng Chung ,  Shou-Jui Hsiang

IPC: B32B25/10 ,  B32B5/02 ,  B32B25/02

Abstract: A composite fabric which is elastic and conductive and thus able to detect a user's limb and body movements includes a fabric layer and an elastic conductive layer of elastomer and conductive filler formed on the fabric layer. A resistance value and a strain increments of the fabric satisfy a relationship of RT=R+nε or RT=R+m enε, wherein ε denotes the strain increment, R denotes the resistance value when the strain increment is 0, and RT denotes the resistance value when deformed through the increments. The m and n are coefficients, being a whole number or a fraction. A user can immediately detect and know the movements of his limbs according to the resistance value of the elastic conductive composite fabric.

公开(公告)号：US11261328B2

公开(公告)日：2022-03-01

申请号：US17121616

申请日：2020-12-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/00 ,  C08J3/24 ,  C08L51/08 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

公开(公告)号：US10822522B2

公开(公告)日：2020-11-03

申请号：US16533932

申请日：2019-08-07

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.