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公开(公告)号：US09820388B2
公开(公告)日：2017-11-14
申请号：US14458236
申请日：2014-08-12
Inventor： Ming-Jaan Ho , Xian-Qin Hu , Zhi-Tian Wang
IPC: H05K3/28
CPC classification number: H05K3/285 , H05K3/282 , H05K2203/013 , H05K2203/1105 , Y10T29/49156
Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.
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公开(公告)号：US09615445B2
公开(公告)日：2017-04-04
申请号：US14858652
申请日：2015-09-18
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Fu-Yun Shen , Ming-Jaan Ho , Yi-Qiang Zhuang
CPC classification number: H05K1/0216 , H05K1/0219 , H05K1/0237 , H05K1/024 , H05K1/09 , H05K3/06 , H05K3/4697 , H05K2201/0154 , H05K2201/0394 , H05K2201/09618 , H05K2203/063
Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.
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公开(公告)号：US09357631B2
公开(公告)日：2016-05-31
申请号：US14162769
申请日：2014-01-24
Inventor： Ming-Jaan Ho , Xian-Qin Hu , Shao-Hua Wang , Fu-Yun Shen
CPC classification number: H05K1/0215 , H05K1/0216 , H05K1/0393 , H05K3/288 , H05K2201/0116 , H05K2201/0145 , H05K2201/0154 , H05K2201/2009 , H05K2203/0221 , H05K2203/095 , H05K2203/1194
Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.
Abstract translation: FPCB包括柔性基底，形成在基底的顶表面上的布线层，形成在布线层上的覆盖层和形成在覆盖层的一部分上的屏蔽层。 布线层包括接地线。 覆盖层限定了将接地线暴露于外部的开口。 屏蔽层的一部分填充到开口中。 屏蔽层通过开口与接地线电连接。
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公开(公告)号：US09706640B2
公开(公告)日：2017-07-11
申请号：US14928166
申请日：2015-10-30
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Ming-Jaan Ho , Xian-Qin Hu , Yi-Qiang Zhuang , Fu-Wei Zhong
CPC classification number: H05K1/024 , H05K1/0221 , H05K3/4623 , H05K3/4697 , H05K2203/061
Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.
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公开(公告)号：US09622340B2
公开(公告)日：2017-04-11
申请号：US14858953
申请日：2015-09-18
Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Yan-Lu Li , Wen-Hsin Yu , Ming-Jaan Ho
CPC classification number: H05K1/0228 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/028 , H05K1/0393 , H05K3/10 , H05K3/243 , H05K3/28 , H05K3/281 , H05K2201/0355 , H05K2201/0715
Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.
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Patent Agency Ranking
公开(公告)号：US09288914B2
公开(公告)日：2016-03-15
申请号：US14082196
申请日：2013-11-18
Inventor： Ming-Jaan Ho , Xian-Qin Hu
CPC classification number: H05K3/281 , H05K1/11 , H05K3/202 , H05K2201/0145 , H05K2203/063 , H05K2203/068 , Y10T29/302
Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.
Abstract translation: 具有电路可见的印刷电路板包括按照上述顺序堆叠的布线层，第一粘合剂层，第一介电层和覆盖膜，所述布线层包括至少一个电接触焊盘。 覆盖膜具有至少一个对应于电接触垫的开口。 覆盖膜包括第二介电层和第二粘合剂层。 第一粘合剂层的流动起始温度在85摄氏度到90摄氏度的范围内，第一粘合剂的硬化温度低于150摄氏度。
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公开(公告)号：US10012454B2
公开(公告)日：2018-07-03
申请号：US14691258
申请日：2015-04-20
Inventor： Xian-Qin Hu , Fu-Yun Shen , Ming-Jaan Ho
CPC classification number: F28F21/085 , F28D15/02 , F28F3/048 , F28F2275/025
Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
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公开(公告)号：US09693448B2
公开(公告)日：2017-06-27
申请号：US14926195
申请日：2015-10-29
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Ming-Jaan Ho
CPC classification number: H05K1/0219 , H05K1/0221 , H05K1/024 , H05K1/0296 , H05K3/022 , H05K3/06 , H05K3/4697 , H05K2201/05 , H05K2201/0715
Abstract: A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.
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公开(公告)号：US09485859B1
公开(公告)日：2016-11-01
申请号：US14859857
申请日：2015-09-21
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Fu-Yun Shen , Jian Luo , Ming-Jaan Ho , Yi-Qiang Zhuang
CPC classification number: H05K1/0219 , H01P3/003 , H01P3/085 , H01P11/003 , H05K1/024 , H05K1/189 , H05K3/4652 , H05K3/4697 , H05K2201/0154 , H05K2201/05 , H05K2201/0715 , H05K2201/09618 , H05K2201/09809
Abstract: A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.
Abstract translation: 柔性电路板包括第一基底层，电路层，第二基底层和结合层。 电路层耦合到第一基极层的一侧，并且包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 接合层将第二基底层耦合到电路层，并且限定对应于线性信号线的第一开口并与电路层的中空区域连通。 接合层和电路层的中空区域的第一开口协调地限定围绕线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US09277640B2
公开(公告)日：2016-03-01
申请号：US14586986
申请日：2014-12-31
Inventor： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Yi-Qiang Zhuang
CPC classification number: H05K1/0218 , H05K1/0219 , H05K1/0393 , H05K2201/0715 , H05K2201/09509 , Y10T156/1057
Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
Abstract translation: 柔性印刷电路板包括柔性印刷电路单元和电磁屏蔽结构。 柔性印刷电路单元包括基底层和形成在基底层的表面上的第一电路层。 电磁屏蔽结构包括第一绝缘层和铜层。 第一绝缘层粘附在远离基层的第一电路层的表面上。 在电磁屏蔽结构中至少定义一个盲孔。 铜层通过填充在盲孔中的电镀结构电连接到第一电路层。
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