Invention Grant
- Patent Title: Signal delivery in stacked device
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Application No.: US16665923Application Date: 2019-10-28
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Publication No.: US11264360B2Publication Date: 2022-03-01
- Inventor: Brent Keeth , Mark Hiatt , Terry R. Lee , Mark Tuttle , Rahul Advani , John F. Schreck
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H01L25/065 ; H01L23/50 ; H01L23/66 ; H01L23/538
Abstract:
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
Public/Granted literature
- US20200058621A1 SIGNAL DELIVERY IN STACKED DEVICE Public/Granted day:2020-02-20
Information query
