公开(公告)号：US20220415855A1

公开(公告)日：2022-12-29

申请号：US17682773

申请日：2022-02-28

Applicant: Micron Technology, Inc.

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H01L25/065 ,  H01L23/50 ,  H01L23/66

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

公开(公告)号：US11264360B2

公开(公告)日：2022-03-01

申请号：US16665923

申请日：2019-10-28

Applicant: Micron Technology, Inc.

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H05K3/02 ,  H01L25/065 ,  H01L23/50 ,  H01L23/66 ,  H01L23/538

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

公开(公告)号：US20200058621A1

公开(公告)日：2020-02-20

申请号：US16665923

申请日：2019-10-28

Applicant: Micron Technology, Inc.

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/50

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

公开(公告)号：US20160240515A1

公开(公告)日：2016-08-18

申请号：US15137931

申请日：2016-04-25

Applicant: Micron Technology, Inc.

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/50

CPC classification number: H01L25/0657 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01004 ,  H01L2924/15192 ,  H01L2924/15311 ,  Y10T29/49165 ,  Y10T29/5317

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

公开(公告)号：US10468382B2

公开(公告)日：2019-11-05

申请号：US15137931

申请日：2016-04-25

Applicant: Micron Technology, Inc.

Inventor： Brent Keeth ,  Mark Hiatt ,  Terry R. Lee ,  Mark Tuttle ,  Rahul Advani ,  John F. Schreck

IPC: B23P19/00 ,  H01L25/065 ,  H01L23/50 ,  H01L23/66 ,  H01L23/538

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.