Invention Grant
- Patent Title: Source/drain contact having a protruding segment
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Application No.: US16776205Application Date: 2020-01-29
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Publication No.: US11264393B2Publication Date: 2022-03-01
- Inventor: Jui-Lin Chen , Chao-Yuan Chang , Ping-Wei Wang , Fu-Kai Yang , Ting Fang , I-Wen Wu , Shih-Hao Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L29/417 ; H01L23/522 ; H01L21/768 ; H01L21/02 ; H01L29/40

Abstract:
A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
Public/Granted literature
- US20210098468A1 Source/Drain Contact Having a Protruding Segment Public/Granted day:2021-04-01
Information query
IPC分类: