Invention Grant
- Patent Title: Wired circuit board and production method thereof
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Application No.: US17237616Application Date: 2021-04-22
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Publication No.: US11266024B2Publication Date: 2022-03-01
- Inventor: Shusaku Shibata , Takahiro Takano , Hayato Takakura , Yoshihiro Kawamura , Shuichi Wakaki
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2016-232481 20161130
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/10 ; H05K1/18 ; H05K3/18

Abstract:
An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
Public/Granted literature
- US20210243900A1 WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF Public/Granted day:2021-08-05
Information query