Invention Grant
- Patent Title: Field effect transistors with gate electrode self-aligned to semiconductor fin
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Application No.: US16303654Application Date: 2016-06-17
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Publication No.: US11276755B2Publication Date: 2022-03-15
- Inventor: Sean T. Ma , Matthew V. Metz , Willy Rachmady , Gilbert Dewey , Chandra S. Mohapatra , Jack T. Kavalieros , Anand S. Murthy , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- International Application: PCT/US2016/038208 WO 20160617
- International Announcement: WO2017/218014 WO 20171221
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/10 ; H01L21/02 ; H01L21/8258 ; H01L27/092 ; H01L29/06 ; H01L29/161 ; H01L29/20 ; H01L29/66 ; H01L29/78

Abstract:
Monolithic FETs including a fin of a first semiconductor composition disposed on a sub-fin of a second composition. In some examples, an InGaAs fin is grown over GaAs sub-fin. The sub-fin may be epitaxially grown from a seeding surface disposed within a trench defined in an isolation dielectric. The sub-fin may be planarized with the isolation dielectric. The fin may then be epitaxially grown from the planarized surface of the sub-fin. A gate stack may be disposed over the fin with the gate stack contacting the planarized surface of the isolation dielectric so as to be self-aligned with the interface between the fin and sub-fin. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20200321435A1 FIELD EFFECT TRANSISTORS WITH GATE ELECTRODE SELF-ALIGNED TO SEMICONDUCTOR FIN Public/Granted day:2020-10-08
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