Invention Grant
- Patent Title: Device and method for debonding a structure from a main surface region of a carrier
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Application No.: US16504811Application Date: 2019-07-08
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Publication No.: US11279120B2Publication Date: 2022-03-22
- Inventor: Alfred Sigi , Dominic Maier , Daniel Porwol
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Priority: EP18184213 20180718
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B32B38/10 ; B32B38/18

Abstract:
A device for debonding a structure from a main surface region of a carrier includes a tape for laminating to the structure, a first holder and a second holder for spanning the tape and to keep a tension of the tape. The second holder can be movable into a lifted position vertically offset to the main surface region of the carrier. The device can also include a deflecting-element for providing a deflection-line between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted position. The deflecting-element can be moveable parallel to the carrier for moving the deflection-line parallel to the carrier and for debonding the structure, laminated to the tape, from the carrier.
Public/Granted literature
- US20200023630A1 DEVICE AND METHOD FOR DEBONDING A STRUCTURE FROM A MAIN SURFACE REGION OF A CARRIER Public/Granted day:2020-01-23
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