Invention Grant
- Patent Title: Method for forming biochips and biochips with non-organic landings for improved thermal budget
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Application No.: US16207490Application Date: 2018-12-03
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Publication No.: US11280786B2Publication Date: 2022-03-22
- Inventor: Chia-Hua Chu , Allen Timothy Chang , Ching-Ray Chen , Yi-Hsien Chang , Yi-Shao Liu , Chun-Ren Cheng , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: G01N33/543
- IPC: G01N33/543 ; H01L21/00

Abstract:
The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.
Public/Granted literature
- US20190101531A1 Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget Public/Granted day:2019-04-04
Information query
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