Invention Grant
- Patent Title: Asymmetry correction via oriented wafer loading
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Application No.: US16552456Application Date: 2019-08-27
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Publication No.: US11282755B2Publication Date: 2022-03-22
- Inventor: Eric Lau , Charles C. Garretson , Huanbo Zhang , Zhize Zhu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; B25J9/16 ; H01L21/306 ; H01L21/67 ; H01L21/687 ; B24B37/30 ; B24B49/12
Abstract:
A chemical mechanical polishing system includes a metrology station having a sensor configured to measure a thickness profile of a substrate, a robotic arm configured to transfer the substrate from the metrology station to a polishing station having, a platen to support a polishing pad having a polishing surface, a carrier head on the polishing surface, the carrier head having a membrane configured to apply pressure to the substrate in the carrier head, and a controller configured to receive measurements from the sensor and configured to control the robotic arm to orient the substrate in the carrier head according to substrate profile and a removal profile for the carrier head.
Public/Granted literature
- US20210066142A1 Asymmetry Correction Via Oriented Wafer Loading Public/Granted day:2021-03-04
Information query
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