公开(公告)号：US20220283554A1

公开(公告)日：2022-09-08

申请号：US17681673

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu ,  Benjamin Cherian ,  Brian J. Brown ,  Thomas H. Osterheld

IPC: G05B13/04 ,  B24B49/00 ,  B24B49/12 ,  B24B49/16 ,  B24B37/005

Abstract: Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrate orientation relative to a carrier head over time, storing a second function defining a polishing rate below a zone of the zone as a function of one or more pressures of one or more zones of the carrier head, and for each particular zone of the plurality of zones, calculate a recipe defining a pressure for the particular zone over time. Calculating the recipe includes calculating an expected thickness profile after polishing from the second function defining the polishing rate and the first function providing substrate orientation relative to the zone over time, and applying a minimizing algorithm to reduce a difference between the expected thickness profile and the target thickness profile.

公开(公告)号：US20240087965A1

公开(公告)日：2024-03-14

申请号：US18511661

申请日：2023-11-16

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B24B37/30 ,  B24B49/12 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L22/26 ,  B24B37/30 ,  B24B49/12 ,  B25J9/1628 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68707 ,  H01L22/20 ,  H01L22/12

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

公开(公告)号：US20240033878A1

公开(公告)日：2024-02-01

申请号：US17874627

申请日：2022-07-27

Applicant: Applied Materials, Inc.

Inventor： Eric L. Lau ,  Huanbo Zhang ,  Zhize Zhu ,  Ekaterina A. Mikhaylichenko ,  Christopher HeungGyun Lee ,  Jeonghoon Oh

IPC: B24B37/30 ,  B24B37/04 ,  B24B53/017

CPC classification number: B24B37/30 ,  B24B37/042 ,  B24B53/017

Abstract: Exemplary polishing methods for chemical mechanical polishing may include engaging a substrate with a membrane of a substrate carrier. The methods may include chucking the substrate against a substantially planar surface defined by the substrate carrier. The chucking may reduce a bow in the substrate. The methods may include polishing one or more materials on the substrate for a first period of time. The methods may include disengaging the substrate from the substantially planar surface. The methods may include polishing the one or more materials on the substrate for a second period of time.

公开(公告)号：US20220208621A1

公开(公告)日：2022-06-30

申请号：US17696813

申请日：2022-03-16

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687 ,  B24B37/30 ,  B24B49/12

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

公开(公告)号：US20210066142A1

公开(公告)日：2021-03-04

申请号：US16552456

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B25J9/16 ,  H01L21/67 ,  H01L21/687 ,  H01L21/306

Abstract: A chemical mechanical polishing system includes a metrology station having a sensor configured to measure a thickness profile of a substrate, a robotic arm configured to transfer the substrate from the metrology station to a polishing station having, a platen to support a polishing pad having a polishing surface, a carrier head on the polishing surface, the carrier head having a membrane configured to apply pressure to the substrate in the carrier head, and a controller configured to receive measurements from the sensor and configured to control the robotic arm to orient the substrate in the carrier head according to substrate profile and a removal profile for the carrier head.

公开(公告)号：US20220281052A1

公开(公告)日：2022-09-08

申请号：US17678932

申请日：2022-02-23

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Andrew J. Nagengast ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: B24B37/005

Abstract: A method for optimizing polishing includes, for each respective retaining ring of a plurality of retaining rings mounted on a particular carrier head, performing measurements for a bottom surface of the respective retaining ring mounted on the particular carrier head using a coordinate measurement machine and collecting a respective removal profile of a substrate polished using the respective retaining ring. A machine learning model is trained based on the measurements of the bottom surface of the retaining ring and the respective removal profiles.

公开(公告)号：US11282755B2

公开(公告)日：2022-03-22

申请号：US16552456

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687 ,  B24B37/30 ,  B24B49/12

Abstract: A chemical mechanical polishing system includes a metrology station having a sensor configured to measure a thickness profile of a substrate, a robotic arm configured to transfer the substrate from the metrology station to a polishing station having, a platen to support a polishing pad having a polishing surface, a carrier head on the polishing surface, the carrier head having a membrane configured to apply pressure to the substrate in the carrier head, and a controller configured to receive measurements from the sensor and configured to control the robotic arm to orient the substrate in the carrier head according to substrate profile and a removal profile for the carrier head.

公开(公告)号：US11931853B2

公开(公告)日：2024-03-19

申请号：US17681677

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu ,  Benjamin Cherian ,  Brian J. Brown ,  Thomas H. Osterheld

IPC: B24B37/005 ,  B24B49/00 ,  B24B49/12 ,  B24B49/16 ,  G05B13/04

CPC classification number: B24B37/005 ,  B24B49/006 ,  B24B49/12 ,  B24B49/16 ,  G05B13/041 ,  G05B13/047

Abstract: Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a zone from a plurality of pressurizable zones of a carrier head that are angularly distributed around a the carrier head. The first function defines polishing rates as a function of pressures. For each particular zone of the plurality of zones a recipe defining a pressure for the particular zone over time is calculated by calculating an expected thickness profile after polishing using the first function, and minimizing a cost function that incorporates a first term representing a difference between the expected thickness profile and a target thickness profile.

公开(公告)号：US11869815B2

公开(公告)日：2024-01-09

申请号：US17696813

申请日：2022-03-16

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu

IPC: H01L21/66 ,  B25J9/16 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687 ,  B24B37/30 ,  B24B49/12

CPC classification number: H01L22/26 ,  B24B37/30 ,  B24B49/12 ,  B25J9/1628 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/68707 ,  H01L22/20 ,  H01L22/12

Abstract: A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.

公开(公告)号：US20220281053A1

公开(公告)日：2022-09-08

申请号：US17681677

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Charles C. Garretson ,  Huanbo Zhang ,  Zhize Zhu ,  Benjamin Cherian ,  Brian J. Brown ,  Thomas H. Osterheld

IPC: B24B37/005

Abstract: Generating a recipe for controlling a polishing system includes receiving a target removal profile that includes a target thickness to remove for a plurality of locations on a substrate that are angularly distributed around the substrate, and storing a first function defining a polishing rate for a zone from a plurality of pressurizable zones of a carrier head that are angularly distributed around a the carrier head. The first function defines polishing rates as a function of pressures. For each particular zone of the plurality of zones a recipe defining a pressure for the particular zone over time is calculated by calculating an expected thickness profile after polishing using the first function, and minimizing a cost function that incorporates a first term representing a difference between the expected thickness profile and a target thickness profile.