Invention Grant
- Patent Title: Methods and apparatus for protection of dielectric films during microelectronic component processing
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Application No.: US16715540Application Date: 2019-12-16
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Publication No.: US11289360B2Publication Date: 2022-03-29
- Inventor: Andrew M. Bayless , Brandon P. Wirz , Wei Zhou
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/67
Abstract:
Disclosed are methods and apparatus for protecting dielectric films on microelectronic components from contamination associated with singulation, picking and handling of singulated microelectronic components from a wafer for assembly with other components.
Public/Granted literature
- US20210183682A1 METHODS AND APPARATUS FOR PROTECTION OF DIELECTRIC FILMS DURING MICROELECTRONIC COMPONENT PROCESSING Public/Granted day:2021-06-17
Information query
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