Invention Grant
- Patent Title: Methods of forming epitaxial source/drain features in semiconductor devices
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Application No.: US16727766Application Date: 2019-12-26
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Publication No.: US11289574B2Publication Date: 2022-03-29
- Inventor: Tzu-Hsiang Hsu , Ting-Yeh Chen , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/8234 ; H01L29/66 ; H01L27/088 ; H01L29/78

Abstract:
A semiconductor structure includes a semiconductor fin disposed over a substrate, a metal gate stack disposed over the semiconductor fin, an epitaxial source/drain (S/D) feature disposed over the semiconductor fin and adjacent to the metal gate stack, and a dielectric feature embedded in the semiconductor fin, where a bottom surface of the epitaxial S/D feature is disposed on a top surface of the dielectric feature, and where sidewalls of the epitaxial S/D feature extend to define sidewalls of the dielectric feature.
Public/Granted literature
- US20210202699A1 Methods of Forming Epitaxial Source/Drain Feautures in Semiconductor Devices Public/Granted day:2021-07-01
Information query
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