Invention Grant
- Patent Title: Scaling interface architecture between memory and programmable logic
-
Application No.: US15853005Application Date: 2017-12-22
-
Publication No.: US11301412B2Publication Date: 2022-04-12
- Inventor: Chee Hak Teh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder PC
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/40 ; G06F13/16

Abstract:
Systems and methods for an interface with a widened interface-to-fabric shoreline between semiconductor circuits and a narrower interface-to-memory controller shoreline. The interface providing transitions from a first clock of a first circuit (e.g., field-programmable gate array (FPGA)), a second clock of a second circuit (e.g., high-bandwidth memory generation 2 (HBM2) stack, and a third clock of a physical layer of the second circuit. A first transfer between the first clock and the second clock may use a first set of first-in first-outs (FIFO) buffers, such as rate-matching FIFO buffers. A second transfer between the second clock and the third clock may use a second set of FIFO buffers, such as phase compensation FIFOs.
Public/Granted literature
- US20190197006A1 SCALING INTERFACE ARCHITECTURE BETWEEN MEMORY AND PROGRAMMABLE LOGIC Public/Granted day:2019-06-27
Information query