Invention Grant
- Patent Title: Semiconductor devices having gate dielectric layers of varying thicknesses and methods of forming the same
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Application No.: US16745107Application Date: 2020-01-16
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Publication No.: US11302692B2Publication Date: 2022-04-12
- Inventor: Ta-Chun Lin , Kuo-Hua Pan , Jhon Jhy Liaw , Shien-Yang Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L29/06

Abstract:
A semiconductor device includes a substrate; an I/O device over the substrate; and a core device over the substrate. The I/O device includes a first gate structure having an interfacial layer; a first high-k dielectric stack over the interfacial layer; and a conductive layer over and in physical contact with the first high-k dielectric stack. The core device includes a second gate structure having the interfacial layer; a second high-k dielectric stack over the interfacial layer; and the conductive layer over and in physical contact with the second high-k dielectric stack. The first high-k dielectric stack includes the second high-k dielectric stack and a third dielectric layer.
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