Invention Grant
- Patent Title: Measurement of device materials using non-Faradaic electrochemical impedance spectroscopy
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Application No.: US16375752Application Date: 2019-04-04
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Publication No.: US11311215B2Publication Date: 2022-04-26
- Inventor: Chi-En Lin , David Probst , Mohsen Askarinya , Akhil Srinivasan , Melissa Tsang , Michael E. Miller , Parisa Kamgar
- Applicant: MEDTRONIC MINIMED, INC.
- Applicant Address: US CA Northridge
- Assignee: MEDTRONIC MINIMED, INC.
- Current Assignee: MEDTRONIC MINIMED, INC.
- Current Assignee Address: US CA Northridge
- Agency: Gates & Cooper LLP
- Main IPC: A61B5/145
- IPC: A61B5/145 ; A61B5/1486 ; G01N27/327 ; C12Q1/54 ; G01N27/02 ; A61B5/00 ; C12Q1/00

Abstract:
The invention includes method and materials designed to measure the material properties (e.g. thickness) of layers of material in a sensor using non-Faradaic EIS (Electrochemical Impedance Spectroscopy) methods. The methods are non-destructive, very sensitive and rapid. Typically in these methods, an AC voltage is applied to the desired material layer while the output current and therefore impedance is measured. This voltage can be applied in multiple frequencies in sweep mode in order to detect both the material and, for example, the thickness of the target material. In this way, EIS allows the characterization of properties of various layers of material disposed in devices such as electrochemical glucose sensors.
Public/Granted literature
- US20200315504A1 MEASUREMENT OF DEVICE MATERIALS USING NON-FARADAIC ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY Public/Granted day:2020-10-08
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