公开(公告)号：US11654235B2

公开(公告)日：2023-05-23

申请号：US16569401

申请日：2019-09-12

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Akhil Srinivasan ,  Peter Ajemba ,  Steven C. Jacks ,  Robert C. Mucic ,  Tyler R. Wong ,  Melissa Tsang ,  Chi-En Lin ,  Mohsen Askarinya ,  David Probst

IPC: A61B5/1495 ,  A61B5/145 ,  A61M5/172 ,  A61M5/142 ,  A61B5/00 ,  G16H20/17

CPC classification number: A61M5/1723 ,  A61B5/1495 ,  A61B5/14532 ,  A61M5/14244 ,  A61B5/145 ,  A61B5/4839 ,  A61B2560/0223 ,  A61B2560/0228 ,  A61B2560/0238 ,  A61M2005/14208 ,  G16H20/17

Abstract: Medical devices and related systems and methods are provided. A method of calibrating an instance of a sensing element involves obtaining fabrication process measurement data from a substrate having the instance of the sensing element fabricated thereon, obtaining a calibration model associated with the sensing element, determining calibration data associated with the instance of the sensing element for converting the electrical signals into a calibrated measurement parameter based on the fabrication process measurement data using the calibration model, and storing the calibration data in a data storage element associated with the instance of the sensing element.

公开(公告)号：US11311215B2

公开(公告)日：2022-04-26

申请号：US16375752

申请日：2019-04-04

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Chi-En Lin ,  David Probst ,  Mohsen Askarinya ,  Akhil Srinivasan ,  Melissa Tsang ,  Michael E. Miller ,  Parisa Kamgar

IPC: A61B5/145 ,  A61B5/1486 ,  G01N27/327 ,  C12Q1/54 ,  G01N27/02 ,  A61B5/00 ,  C12Q1/00

Abstract: The invention includes method and materials designed to measure the material properties (e.g. thickness) of layers of material in a sensor using non-Faradaic EIS (Electrochemical Impedance Spectroscopy) methods. The methods are non-destructive, very sensitive and rapid. Typically in these methods, an AC voltage is applied to the desired material layer while the output current and therefore impedance is measured. This voltage can be applied in multiple frequencies in sweep mode in order to detect both the material and, for example, the thickness of the target material. In this way, EIS allows the characterization of properties of various layers of material disposed in devices such as electrochemical glucose sensors.

公开(公告)号：US20210077717A1

公开(公告)日：2021-03-18

申请号：US16569401

申请日：2019-09-12

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Akhil Srinivasan ,  Peter Ajemba ,  Steven C. Jacks ,  Robert C. Mucic ,  Tyler R. Wong ,  Melissa Tsang ,  Chi-En Lin ,  Mohsen Askarinya ,  David Probst

IPC: A61M5/172 ,  A61B5/145 ,  A61M5/142 ,  A61B5/1495

Abstract: Medical devices and related systems and methods are provided. A method of calibrating an instance of a sensing element involves obtaining fabrication process measurement data from a substrate having the instance of the sensing element fabricated thereon, obtaining a calibration model associated with the sensing element, determining calibration data associated with the instance of the sensing element for converting the electrical signals into a calibrated measurement parameter based on the fabrication process measurement data using the calibration model, and storing the calibration data in a data storage element associated with the instance of the sensing element.

公开(公告)号：US20200315504A1

公开(公告)日：2020-10-08

申请号：US16375752

申请日：2019-04-04

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Chi-En Lin ,  David Probst ,  Mohsen Askarinya ,  Akhil Srinivasan ,  Melissa Tsang ,  Michael E. Miller ,  Parisa Kamgar

IPC: A61B5/145 ,  A61B5/1486 ,  C12Q1/54 ,  G01N27/327 ,  A61B5/00

Abstract: The invention includes method and materials designed to measure the material properties (e.g. thickness) of layers of material in a sensor using non-Faradaic EIS (Electrochemical Impedance Spectroscopy) methods. The methods are non-destructive, very sensitive and rapid. Typically in these methods, an AC voltage is applied to the desired material layer while the output current and therefore impedance is measured. This voltage can be applied in multiple frequencies in sweep mode in order to detect both the material and, for example, the thickness of the target material. In this way, EIS allows the characterization of properties of various layers of material disposed in devices such as electrochemical glucose sensors.

公开(公告)号：US20190090743A1

公开(公告)日：2019-03-28

申请号：US15716426

申请日：2017-09-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Daniel Hahn ,  David Probst ,  Randal Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468

Abstract: Processes for fabricating physiological characteristic sensor devices are disclosed here. An embodiment of the fabrication process forms a circuit pattern on a base substrate, where the circuit pattern includes circuit layouts for multiple die locations. Component stacks are mounted to the circuit layouts. Each stack has features and components to provide processing and wireless communication functionality for obtained sensor data. An enclosure structure is formed overlying the base substrate to individually cover and enclose each of the component stacks. Sensor elements are fabricated on another surface of the substrate such that each sensor element has electrodes coupled to conductive plug elements formed through the substrate, and such that each sensor element corresponds to one die location. Next, the substrate is separated into physically discrete sensor device components.

公开(公告)号：US20230241315A1

公开(公告)日：2023-08-03

申请号：US18132321

申请日：2023-04-07

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Akhil Srinivasan ,  Peter Ajemba ,  Steven C. Jacks ,  Robert C. Mucic ,  Tyler R. Wong ,  Melissa Tsang ,  Chi-En Lin ,  Mohsen Askarinya ,  David Probst

IPC: A61M5/172 ,  A61B5/145 ,  A61M5/142 ,  A61B5/1495

CPC classification number: A61M5/1723 ,  A61B5/14532 ,  A61M5/14244 ,  A61B5/1495 ,  A61B5/4839

Abstract: Medical devices and related systems and methods are provided. A method of controlling medication delivery based on sensor input involves obtaining a measurement parameter representing an electrical response of a first instance of a sensing element to a physiological condition of a person. The measurement parameter is converted into a calibrated measurement parameter using calibration data specific to the first instance of the sensing element. The method further involves determining a measurement value using the calibrated measurement parameter as input to a performance model. The performance model is derived from historical calibrated measurement parameters and corresponding reference values. The historical calibrated measurement parameters are from other instances of the sensing element. A command is then determined based on the measurement value and sent to a medical device. The command causes the medical device to deliver a dose of medication influencing the physiological condition of the person.

公开(公告)号：US20190090742A1

公开(公告)日：2019-03-28

申请号：US15716424

申请日：2017-09-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Daniel Hahn ,  David Probst ,  Randal Schulhauser ,  Mohsen Askarinya ,  Patrick W. Kinzie ,  Thomas P. Miltich ,  Mark D. Breyen ,  Santhisagar Vaddiraju

IPC: A61B5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/78 ,  H01L23/055 ,  H01L23/498 ,  H01L23/66 ,  A61B5/145 ,  A61B5/1468

Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.