Invention Grant
- Patent Title: Material-fixing substrate and method for producing same, and material-fixing agent used for material-fixing substrate
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Application No.: US16303987Application Date: 2017-05-02
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Publication No.: US11312942B2Publication Date: 2022-04-26
- Inventor: Shunichi Suwa , Kunihiko Nagamine , Masahiro Matsumoto , Daisuke Yamaguchi , Yoshio Goto , Kyohei Yoshimitsu
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2016-114424 20160608
- International Application: PCT/JP2017/017263 WO 20170502
- International Announcement: WO2017/212838 WO 20171214
- Main IPC: C12N5/09
- IPC: C12N5/09 ; C07D403/04 ; C07D225/02 ; G01N33/543 ; C07K17/00 ; G01N33/50

Abstract:
Provided is a material-fixing substrate that does not have to use copper as a catalyst because the substrate-bonding site includes a cyclic alkyne to form a covalent bond with a surface of the substrate, and therefore that can reduce damage to a cell, for example, in a case where a to-be-fixed material is the cell. The material-fixing substrate has a to-be-fixed material fixed thereon via a material-fixing agent. The material-fixing agent includes: a substrate-bonding site that forms a covalent bond with a surface of the substrate and includes at least a cyclic alkyne; a hydrophilic site that is bonded to the substrate-bonding site; a light-responsive site that is bonded to the hydrophilic site and changes the skeleton thereof by irradiation with light; and an attachment site to which the to-be-fixed material is attached.
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