Invention Grant
- Patent Title: Resistive random access memory and manufacturing method thereof
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Application No.: US17109147Application Date: 2020-12-02
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Publication No.: US11316106B2Publication Date: 2022-04-26
- Inventor: Chung-Hsuan Wang , Yu-Ting Chen , Tz-Hau Guo , Chang-Hsuan Wu , Chiung-Lin Hsu
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW108147399 20191224
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
Provided are a resistive random access memory and a manufacturing method thereof. The resistive random access memory includes first, second, and third electrodes, a variable resistance layer, a selection layer, and first and second bit lines. The second electrode and the third electrode are on the first electrode. The second and third electrodes are separated from each other and overlapped with the sidewall and the top surface of the first electrode. The variable resistance layer is between the first and second electrodes and between the first and third electrodes. The selection layer is between the variable resistance layer and the first electrode. The first bit line is on the second electrode and electrically connected to the second electrode via a first contact. The second bit line is on the third electrode and electrically connected to the third electrode via a second contact.
Public/Granted literature
- US20210193918A1 RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-06-24
Information query
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