Invention Grant
- Patent Title: Microfluidic component package
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Application No.: US16168020Application Date: 2018-10-23
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Publication No.: US11331663B2Publication Date: 2022-05-17
- Inventor: Mark Bachman , Sarkis Babikian , Guann-Pyng Li
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: One LLP
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B01L9/00 ; B81B7/00 ; B81C1/00 ; B23K1/00 ; B23K101/42
Abstract:
A microfluidic component package that is readily integratable within a microfluidic system.
Public/Granted literature
- US20190321821A1 MICROFLUIDIC COMPONENT PACKAGE Public/Granted day:2019-10-24
Information query
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