Invention Grant
- Patent Title: Method of processing wire bundles
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Application No.: US16655053Application Date: 2019-10-16
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Publication No.: US11332339B2Publication Date: 2022-05-17
- Inventor: Eerik J. Helmick , Bradley J. Mitchell , Nick S. Evans , Damien O. Martin , Aphea Ann Thornton
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: H01F7/06
- IPC: H01F7/06 ; B65H59/10 ; H01R43/048 ; H02G1/12 ; H01R43/28 ; B65H51/005 ; H01R43/20 ; H02G1/06 ; H01R43/052 ; H02G3/04

Abstract:
A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.
Public/Granted literature
- US20200048028A1 METHOD OF PROCESSING WIRE BUNDLES Public/Granted day:2020-02-13
Information query