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    METHOD OF PROCESSING WIRE BUNDLES
    1.
    发明申请
    METHOD OF PROCESSING WIRE BUNDLES 审中-公开

    公开(公告)号：US20200048028A1

    公开(公告)日：2020-02-13

    申请号：US16655053

    申请日：2019-10-16

    Applicant: The Boeing Company

    Inventor： Eerik J. Helmick ,  Bradley J. Mitchell ,  Nick S. Evans ,  Damien O. Martin ,  Aphea Ann Thornton

    IPC: B65H59/10 ,  B65H51/005 ,  H01R43/048 ,  H02G1/12 ,  H01R43/28

    Abstract: A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

    WIRE BUNDLE PROCESSING METHOD
    2.
    发明申请
    WIRE BUNDLE PROCESSING METHOD 审中-公开

    公开(公告)号：US20200048027A1

    公开(公告)日：2020-02-13

    申请号：US16655019

    申请日：2019-10-16

    Applicant: The Boeing Company

    Inventor： Bradley J. Mitchell ,  Nick S. Evans ,  Damien O. Martin ,  Aphea Ann Thornton ,  Eerik J. Helmick

    IPC: B65H59/10 ,  H01R43/28 ,  H02G1/14 ,  B65H51/005

    Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

    Cable processing apparatus and method
    6.
    发明授权
    Cable processing apparatus and method 有权

    公开(公告)号：US10742005B2

    公开(公告)日：2020-08-11

    申请号：US15497045

    申请日：2017-04-25

    Applicant: The Boeing Company

    Inventor： Eerik J. Helmick

    IPC: H02G1/12 ,  H01R43/05 ,  B23P23/00 ,  H01R43/28

    Abstract: A cable processing apparatus including a first housing member having a first interface surface, a second housing member having a second interface surface, the second interface surface opposes the first interface surface. At least one abrasive member unit coupled to at least one of the first and second housing members so as to be disposed between the first and second interface surfaces. A controller coupled to the first and second housing members and the at least one abrasive member unit for moving the first and second housing members to clamp a cable extending through the first and second housing members, actuating the at least one abrasive member unit, and moving the second housing member relative to the first housing member to radially expand shielding of the cable where the radially expanded cable shielding is ground off of the cable by the at least one abrasive member unit.

    Vibrating pallet system for automated wire insertion
    7.
    发明授权
    Vibrating pallet system for automated wire insertion 有权

    公开(公告)号：US10109974B2

    公开(公告)日：2018-10-23

    申请号：US15010525

    申请日：2016-01-29

    Applicant: THE BOEING COMPANY

    Inventor： Eerik J. Helmick ,  Bradley J. Mitchell

    IPC: H01R43/20 ,  H01R43/28 ,  H01R33/90 ,  H01R39/64 ,  H01L41/053

    Abstract: A wire insertion system includes a fixture, a first vibrating element connected to the fixture, and a gripper adapted to interface with the fixture and to support a plurality of wires, in which the gripper includes a body, at least one gripping member coupled to the body, and a second vibrating element connected to the gripper. The wire insertion system further includes a sensor coupled to the fixture, and a controller coupled to the sensor and in communication with the first vibrating element, the second vibrating element, and the gripper, and configured to vibrate the first vibrating element and the second vibrating element using signals from the sensor.

    Systems and methods for maintaining orientation of an electrical connector during an assembly process
    8.
    发明授权
    Systems and methods for maintaining orientation of an electrical connector during an assembly process 有权

    公开(公告)号：US11296473B2

    公开(公告)日：2022-04-05

    申请号：US16810001

    申请日：2020-03-05

    Applicant: THE BOEING COMPANY

    Inventor： Eerik J. Helmick

    IPC: H01R43/00 ,  H01R43/16

    Abstract: A connector support assembly is configured to securely retain a mating connector during an assembling process of an electrical connector. The connector support assembly includes a universal base, and a plurality of inserts configured to be interchangeably retained by the universal base. Each of the inserts includes a base connection interface that is configured to be retained by the universal base, and at least one shell connection interface. The shell connection interface(s) of at least two of the inserts are configured to retain different sized shells of different mating connectors.

    Vibrating pallet system for automated wire insertion
    9.
    发明授权
    Vibrating pallet system for automated wire insertion 有权

    公开(公告)号：US11271353B2

    公开(公告)日：2022-03-08

    申请号：US16129538

    申请日：2018-09-12

    Applicant: THE BOEING COMPANY

    Inventor： Eerik J. Helmick ,  Bradley J. Mitchell

    IPC: H01R43/20 ,  H01B13/012 ,  H01R33/90 ,  H01R43/28 ,  H01R43/02 ,  H01R39/64 ,  H01L41/053 ,  H01R13/66

    Abstract: An apparatus is provided relating to the insertion of one or more wires into a cavity of a fixture of a structure or component. The wire insertion apparatus includes a grommet, a gripper adapted to interface with the grommet, and at least a first vibrating element. The first vibrating element is connected to and vibrates one or more of the apparatus, the grommet, the gripper, the wire, and/or a component of the apparatus. Vibration, induced in any direction, enables the cavities to shift position during insertion relative to the contact, thus increasing the tolerance of the cavity, reducing the failure rate of wire insertion, and reducing total production time. The vibration breaks the static friction of the contact in the grommet or dielectric opening, creates the positive locating required to insert the contact in the grommet and/or dielectric, and/or pivots the contact.

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