A cantilever probe head includes a support ring associated with a PCB board and a plurality of contact probes, protruding from the support ring in a cantilever manner and being held by a support associated with the support ring. Each contact probe has a rod-like body having a longitudinal axis inclined with respect to a reference plane corresponding to a plane of a wafer of devices under test by the cantilever probe head, as well as at least one first end portion, provided in a first probe section protruding from the support in the direction of the wafer of devices under test, the first end portion being bent with respect to the longitudinal axis starting from a bending point and ending with a contact tip of the contact probe able to abut onto a contact pad of a device under test of the wafer.