Invention Grant
- Patent Title: Polishing liquid and polishing method
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Application No.: US16461578Application Date: 2017-08-15
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Publication No.: US11339309B2Publication Date: 2022-05-24
- Inventor: Ken Matsuo , Masayuki Matsuyama , Mikimasa Horiuchi , Akinori Kumagai
- Applicant: Mitsui Mining & Smelting Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2016-249129 20161222
- International Application: PCT/JP2017/029370 WO 20170815
- International Announcement: WO2018/116521 WO 20180628
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C08K3/013 ; C08K5/19 ; C08L1/10 ; C08K3/22 ; C09K109/00

Abstract:
A polishing liquid is provided containing manganese oxide abrasive grains, permanganate ions, and a cellulosic surfactant or a cationic surfactant. The polishing liquid has a pH of 5 or more and 11 or less. The cellulosic surfactant is preferably a carboxymethyl cellulose or a derivative thereof. The cationic surfactant preferably has a quaternary ammonium ion site. The content of the cellulosic surfactant or the cationic surfactant is preferably 0.01 mass % or more and 1.0 mass % or less based on the total amount of the polishing liquid.
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