Invention Grant
- Patent Title: Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same
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Application No.: US16428609Application Date: 2019-05-31
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Publication No.: US11345813B2Publication Date: 2022-05-31
- Inventor: Shur-Fen Liu , Chin-Hsien Hung
- Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei
- Agency: Christensen, Fonder, Dardi & Herbert PLLC
- Priority: TW108115829 20190508
- Main IPC: C08L71/12
- IPC: C08L71/12 ; B32B15/085 ; B32B25/14 ; B32B27/30 ; H05K1/03 ; C08K5/5397 ; B32B15/06 ; C08L9/02 ; C08L9/06 ; C08K5/3415 ; C08K5/52 ; C08L55/02 ; C08K5/00 ; C08K3/013 ; C08J5/24 ; B32B15/082
Abstract:
A resin composition is provided. The resin composition comprises: (A) a polyphenylene ether resin which has an unsaturated functional group; and (B) a first cross-linking agent represented by the following formula (I):
Information query
IPC分类:
