公开(公告)号：US11345813B2

公开(公告)日：2022-05-31

申请号：US16428609

申请日：2019-05-31

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Chin-Hsien Hung

IPC: C08L71/12 ,  B32B15/085 ,  B32B25/14 ,  B32B27/30 ,  H05K1/03 ,  C08K5/5397 ,  B32B15/06 ,  C08L9/02 ,  C08L9/06 ,  C08K5/3415 ,  C08K5/52 ,  C08L55/02 ,  C08K5/00 ,  C08K3/013 ,  C08J5/24 ,  B32B15/082

Abstract: A resin composition is provided. The resin composition comprises: (A) a polyphenylene ether resin which has an unsaturated functional group; and (B) a first cross-linking agent represented by the following formula (I):

公开(公告)号：US11124613B2

公开(公告)日：2021-09-21

申请号：US16575810

申请日：2019-09-19

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Chin-Hsien Hung

IPC: C08J3/24 ,  C08G65/48 ,  C08L71/12 ,  C08K5/03 ,  C08K3/36 ,  C07D251/32 ,  B32B15/08 ,  C08J5/24 ,  C08K5/3492 ,  C08K5/14

Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components:
(A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

公开(公告)号：US10793716B2

公开(公告)日：2020-10-06

申请号：US13834341

申请日：2013-03-15

Applicant: Taiwan Union Technology Corporation

Inventor： Meng-Huei Chen ,  Shur-Fen Liu

IPC: C08L71/12 ,  B32B15/14 ,  C08J5/24 ,  B32B15/20 ,  B32B5/02

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): (b) a nonpolar elastomer containing vinyl group, wherein the content of the vinyl group is no more than 60%; and (c) a peroxide as a polymerization initiator, wherein, R1, R2, A1, A2, and n are as defined in the specification; and the content of component (b) is about 2% to about 100% based on the weight of component (a), and the content of component (c) is about 0.01% to about 10% based on the total weight of component (a) and component (b).

公开(公告)号：US20190144666A1

公开(公告)日：2019-05-16

申请号：US16246766

申请日：2019-01-14

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Meng-Huei Chen

IPC: C08L71/12 ,  C08J5/10 ,  B05D3/00 ,  C08J5/24 ,  B32B1/00 ,  C08K5/3492 ,  C08L79/08 ,  B05D1/18

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R′, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

公开(公告)号：US20170260365A1

公开(公告)日：2017-09-14

申请号：US15174107

申请日：2016-06-06

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Meng-Huei Chen

IPC: C08K5/5313 ,  C08L71/12 ,  B32B15/08 ,  C08J5/24 ,  C08K3/36 ,  C08K5/3492 ,  C08L35/00

CPC classification number: C08K5/5313 ,  B32B5/26 ,  B32B7/04 ,  B32B15/08 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/02 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/7246 ,  B32B2307/73 ,  B32B2457/08 ,  C08J5/24 ,  C08J2371/12 ,  C08J2400/26 ,  C08J2463/00 ,  C08J2479/00 ,  C08K3/013 ,  C08K3/36 ,  C08K5/34924 ,  C08K2003/329 ,  C08L35/00 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L71/123

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I), wherein a, R, and Ma+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

公开(公告)号：US09657154B2

公开(公告)日：2017-05-23

申请号：US14582233

申请日：2014-12-24

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Meng-Huei Chen ,  Hsin-Ho Wu

IPC: C08K3/22 ,  C08L63/00 ,  C08L37/00 ,  C08L71/02 ,  C08K5/02 ,  C08J5/24 ,  B32B15/08 ,  B32B27/20 ,  C08J5/10 ,  C09D163/00 ,  C08G59/68

CPC classification number: C08K3/22 ,  B32B15/08 ,  B32B27/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/107 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/686 ,  C08J5/10 ,  C08J5/24 ,  C08J2335/06 ,  C08J2337/00 ,  C08J2363/00 ,  C08J2371/02 ,  C08J2371/12 ,  C08J2435/06 ,  C08J2437/00 ,  C08J2463/00 ,  C08J2471/02 ,  C08K5/02 ,  C08K2003/2206 ,  C08K2003/2237 ,  C08L35/06 ,  C08L37/00 ,  C08L63/00 ,  C08L71/02 ,  C08L71/12 ,  C09D163/00 ,  Y10T428/31678

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

公开(公告)号：US11840047B2

公开(公告)日：2023-12-12

申请号：US16783909

申请日：2020-02-06

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shi-Ing Huang ,  Shur-Fen Liu ,  Kai-Hsiang Lin

IPC: B32B15/14 ,  B32B5/02 ,  B32B15/20 ,  B32B27/12 ,  H05K1/03 ,  B32B27/20 ,  H05K3/02 ,  B32B27/32 ,  B32B27/30

CPC classification number: B32B15/14 ,  B32B5/02 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B27/304 ,  B32B27/322 ,  H05K1/036 ,  H05K3/022 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0195

Abstract: A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises:



a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler;
a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 μm and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and
a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.

公开(公告)号：US10196502B2

公开(公告)日：2019-02-05

申请号：US15174270

申请日：2016-06-06

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Meng-Huei Chen

IPC: C08K5/5399 ,  C08K3/36 ,  C08K13/02 ,  C08K3/00 ,  C08K5/00 ,  C08K5/14 ,  C08K5/3492 ,  B32B15/04 ,  B32B27/04 ,  B32B15/08 ,  B32B27/06 ,  B32B33/00 ,  H05K1/03 ,  C08J5/24 ,  C08L25/10 ,  C08L47/00 ,  C08L53/02 ,  C08L71/12 ,  C08L85/02 ,  C08J5/10 ,  C08K3/016 ,  B32B5/26 ,  B32B7/04 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).

公开(公告)号：US20180339493A1

公开(公告)日：2018-11-29

申请号：US15812243

申请日：2017-11-14

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Wen-Ren Chen ,  Shur-Fen Liu

IPC: B32B15/08 ,  C08J5/24 ,  C08J5/04 ,  C08J5/12 ,  B32B37/14 ,  H05K1/03 ,  H05K3/38

Abstract: A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

公开(公告)号：US20180208765A1

公开(公告)日：2018-07-26

申请号：US15496334

申请日：2017-04-25

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： Shur-Fen Liu ,  Meng-Huei Chen

IPC: C08L71/12 ,  C08J5/24 ,  C09D171/12 ,  H05K1/03 ,  H05K3/00

Abstract: A resin composition is provided. The resin composition comprises the following: (a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and (b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof: wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.