Invention Grant
- Patent Title: Particle removal apparatus and laser cutting apparatus including the same
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Application No.: US16191575Application Date: 2018-11-15
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Publication No.: US11351632B2Publication Date: 2022-06-07
- Inventor: Jaebum Pahk , Jeongho Yi , Dokyun Kwon , Kyongho Hong , Jihun Kang , Cheollae Roh , Gyoowan Han
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Cantor Colburn LLP
- Priority: KR10-2018-0018183 20180214
- Main IPC: B23K26/142
- IPC: B23K26/142 ; B23K26/14 ; B23K26/16 ; B23K26/38 ; B23K26/402 ; B23K37/04 ; B23K101/36

Abstract:
A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.
Public/Granted literature
- US20190247954A1 PARTICLE REMOVAL APPARATUS AND LASER CUTTING APPARATUS INCLUDING THE SAME Public/Granted day:2019-08-15
Information query
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