Invention Grant
- Patent Title: Liquid processing apparatus and liquid processing method
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Application No.: US15659750Application Date: 2017-07-26
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Publication No.: US11353894B2Publication Date: 2022-06-07
- Inventor: Keigo Satake , Hiroshi Komiya , Kouji Ogura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2016-147689 20160727
- Main IPC: G05D7/01
- IPC: G05D7/01 ; H01L21/67 ; G05D7/06

Abstract:
A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.
Public/Granted literature
- US20180032092A1 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD Public/Granted day:2018-02-01
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