公开(公告)号：US10162371B2

公开(公告)日：2018-12-25

申请号：US14536989

申请日：2014-11-10

Applicant: Tokyo Electron Limited

Inventor： Yasuhiro Takaki ,  Hiroshi Komiya ,  Chikara Nobukuni ,  Keigo Satake ,  Atsushi Anamoto

IPC: B01F15/00 ,  B01F3/08 ,  G05D11/13

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

公开(公告)号：US20150131403A1

公开(公告)日：2015-05-14

申请号：US14536989

申请日：2014-11-10

Applicant: Tokyo Electron Limited

Inventor： Yasuhiro Takaki ,  Hiroshi Komiya ,  Chikara Nobukuni ,  Keigo Satake ,  Atsushi Anamoto

IPC: B01F15/00 ,  B01F3/08

CPC classification number: G05D11/138

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

Abstract translation: 基板液体处理装置包括罐; 循环线 处理单元，其通过分支管线连接到循环管线，并且被配置为使用流过循环管线的处理液体在基板上进行液体处理; 处理液生成机构，其通过以受控混合比混合由各原料液源供给的至少两种原料液体来制造处理液; 浓度测量装置，被配置为测量流过所述循环管线的处理液体的浓度和流经所述处理液体供给管线的处理液体的浓度; 以及控制装置，其被配置为基于所测量的处理液体的浓度来控制处理液生成机构。

公开(公告)号：US10591935B2

公开(公告)日：2020-03-17

申请号：US16188525

申请日：2018-11-13

Applicant: Tokyo Electron Limited

Inventor： Yasuhiro Takaki ,  Hiroshi Komiya ,  Chikara Nobukuni ,  Keigo Satake ,  Atsushi Anamoto

IPC: G05D11/13

Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.

公开(公告)号：US12264396B2

公开(公告)日：2025-04-01

申请号：US18517341

申请日：2023-11-22

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakazawa ,  Isamu Miyamoto ,  Keigo Satake ,  Kenji Nakamizo

IPC: C23F1/26 ,  C23F1/08

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

公开(公告)号：US11905603B2

公开(公告)日：2024-02-20

申请号：US17553971

申请日：2021-12-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakazawa ,  Isamu Miyamoto ,  Keigo Satake ,  Kenji Nakamizo

IPC: C23F1/26 ,  C23F1/08

CPC classification number: C23F1/26 ,  C23F1/08

Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.

公开(公告)号：US20160370810A1

公开(公告)日：2016-12-22

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G05D7/06

CPC classification number: G05D7/0635 ,  G05B2219/41303 ,  H01L21/67051 ,  H01L21/67253

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

Abstract translation: 公开了一种包括室，至少一个喷嘴，测量单元，打开/关闭单元和控制器的处理设备。 该室容纳工件。 喷嘴设置在腔室中以朝向工件供应处理流体。 测量单元测量供应到喷嘴的处理流体的供应流量。 打开/关闭单元执行要供给到喷嘴的处理流体的流路的打开/关闭。 控制器以预设的定时输出打开和关闭操作信号。 在输出打开操作信号之后，控制器基于测量单元的测量结果计算处理流体的积分量，并且执行输出定时改变处理以改变从预设定时输出打开或关闭操作信号的定时 基于计算的积分量。

公开(公告)号：US10261521B2

公开(公告)日：2019-04-16

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G06F19/00 ,  G05D7/06 ,  H01L21/67

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

公开(公告)号：US20180032092A1

公开(公告)日：2018-02-01

申请号：US15659750

申请日：2017-07-26

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Hiroshi Komiya ,  Kouji Ogura

IPC: G05D7/01 ,  H01L21/67

CPC classification number: G05D7/01 ,  G05D7/0635 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67253

Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.

公开(公告)号：US20160368114A1

公开(公告)日：2016-12-22

申请号：US15181527

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.

Abstract translation: 公开了一种处理装置，其包括容纳工件的室，设置在室内的喷嘴，测量供给到喷嘴的处理流体的供给流量的测量单元，执行流路开闭的打开/关闭单元 的处理流体，以及控制器。 控制器根据指示处理内容的配方信息发送打开/关闭操作信号，该打开/关闭操作信号使打开/关闭单元执行打开/关闭操作。 根据配方信息向打开/关闭单元发送打开/关闭操作信号后，控制器基于测量单元的测量结果开始积分供给流量，基于以下方式监视供给流量的上升 计算的积分量，以及当提供特定流量时，基于由测量单元实际测量的值监视供给流量。

公开(公告)号：US11353894B2

公开(公告)日：2022-06-07

申请号：US15659750

申请日：2017-07-26

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Hiroshi Komiya ,  Kouji Ogura

IPC: G05D7/01 ,  H01L21/67 ,  G05D7/06

Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.