Invention Grant
- Patent Title: Chip package and manufacturing method thereof
-
Application No.: US17075544Application Date: 2020-10-20
-
Publication No.: US11355659B2Publication Date: 2022-06-07
- Inventor: Po-Han Lee , Chia-Ming Cheng , Wei-Ming Chien
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/18 ; H01L31/02 ; H01L31/0216
Abstract:
A chip package includes a chip and a conductive structure. A first surface of the chip has a photodiode. A second surface of the chip facing away from the first surface has a recess aligned with the photodiode. The conductive structure is located on the first surface of the chip.
Public/Granted literature
- US20210159350A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-05-27
Information query
IPC分类:
