Invention Grant
- Patent Title: Crack detection integrity check
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Application No.: US16746201Application Date: 2020-01-17
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Publication No.: US11366156B2Publication Date: 2022-06-21
- Inventor: Pedro Jr Santos Peralta , David Gani
- Applicant: STMicroelectronics Pte Ltd
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Crowe & Dunlevy
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66 ; G01R31/3185 ; G01R31/26

Abstract:
A method of testing integrated circuit die for presence of a crack includes performing back end integrated circuit fabrication processes on a wafer having a plurality of integrated circuit die, the back end fabrication including an assembly process. The assembly process includes a) lowering a tip of a first manipulator arm to contact a given die such that pogo pins extending from the tip make electrical contact with conductive areas on the given die so that the pogo pins are electrically connected to a crack detector on the given die, b) picking up the given die using the first manipulator arm, and c) performing a conductivity test on the crack detector using the pogo pins to determine presence of a crack in the given die that extends from a periphery of the die, through a die seal ring of the die, and into an integrated circuit region of the die.
Public/Granted literature
- US20200241068A1 CRACK DETECTION INTEGRITY CHECK Public/Granted day:2020-07-30
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