Invention Grant
- Patent Title: Electrostatic chuck and plasma processing apparatus including the same
-
Application No.: US16259185Application Date: 2019-01-28
-
Publication No.: US11367597B2Publication Date: 2022-06-21
- Inventor: Yongwoo Lee , Youngjin Noh , Dowon Kim , Donghyeon Na , Seungbo Shim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, PC
- Priority: KR10-2018-0078385 20180705,KR10-2018-0117573 20181002
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
An electrostatic chuck includes a chuck base having a first hole, an upper plate provided on the chuck base, the upper plate having a second hole aligned with the first hole, and an adhesive layer attaching the upper plate to the chuck base, the adhesive layer having a thickness that is less than a diameter of the first hole and equal to a diameter of the second hole.
Public/Granted literature
- US20200013595A1 ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2020-01-09
Information query
