Electronic device package technology is disclosed. In one example, an electronic device includes a substrate having a bond finger, a die coupled to the substrate and having a bond pad, a first bond wire coupled between the bond pad and the bond finger, and a second bond wire coupled between the bond pad and the bond finger. The first bond wire is reverse bonded between a pad solder ball on the bond pad and a finger solder ball on the bond finger. The second bond wire is forward bonded between a supplemental pad solder ball on the pad solder and the bond finger adjacent the finger solder ball. Associated systems and methods are also disclosed.