- 专利标题: Method for manufacturing peeled substrate
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申请号: US16486316申请日: 2017-10-26
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公开(公告)号: US11383328B2公开(公告)日: 2022-07-12
- 发明人: Junichi Ikeno , Yohei Yamada , Hideki Suzuki , Rika Matsuo
- 申请人: SHIN-ETSU POLYMER CO., LTD. , NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY
- 申请人地址: JP Tokyo; JP Saitama
- 专利权人: SHIN-ETSU POLYMER CO., LTD.,NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY
- 当前专利权人: SHIN-ETSU POLYMER CO., LTD.,NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY
- 当前专利权人地址: JP Tokyo; JP Saitama
- 代理机构: Nath, Goldberg & Meyer
- 代理商 Jerald L. Meyer; Tanya E. Harkins
- 优先权: JPJP2017-027121 20170216
- 国际申请: PCT/JP2017/038669 WO 20171026
- 国际公布: WO2018/150636 WO 20180823
- 主分类号: B23K26/53
- IPC分类号: B23K26/53 ; B23K26/064 ; C01B32/956 ; C09K13/02 ; C30B29/36 ; C30B33/04 ; C30B33/10 ; H01L21/02
摘要:
A method for manufacturing a peeled substrate has a laser condensing step for focusing laser light at a prescribed depth from the surface of a substrate and a positioning step for moving and positioning a laser condenser relative to the substrate, the method involving forming a processed layer in the substrate. The laser condensing step includes a laser light adjustment step in which a diffraction optical element is used to branch the laser light into a plurality of branched laser beams, and at least one of the branched laser beams is branched such that the intensity thereof differs from the other branched laser beams. The processed layer is elongated using the branched laser beam having a relatively high intensity among the plurality of branched laser beams to process the substrate, and the elongation of the processed layer is restrained using the branched laser beams having a relatively low intensity.
公开/授权文献
- US20200230748A1 METHOD FOR MANUFACTURING PEELED SUBSTRATE 公开/授权日:2020-07-23
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