Invention Grant
- Patent Title: Polishing slurry composition for STI process
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Application No.: US16954350Application Date: 2018-11-13
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Publication No.: US11384255B2Publication Date: 2022-07-12
- Inventor: Hae Won Yang , Jun Ha Hwang , Jung Yoon Kim , Kwang Soo Park
- Applicant: KCTECH CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: KCTECH CO., LTD.
- Current Assignee: KCTECH CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: KDB Firm PLLC
- Priority: KR10-2017-0176074 20171220
- International Application: PCT/KR2018/013763 WO 20181113
- International Announcement: WO2019/124741 WO 20190627
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321
Abstract:
The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.
Public/Granted literature
- US20210079262A1 POLISHING SLURRY COMPOSITION FOR STI PROCESS Public/Granted day:2021-03-18
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