Invention Grant
- Patent Title: Encapsulated component attachment technique using a UV-cure conductive adhesive
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Application No.: US17062612Application Date: 2020-10-04
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Publication No.: US11385258B2Publication Date: 2022-07-12
- Inventor: Julie A. Campbell , Karl A. Rinder , Regina R. Mrozik
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Miller Nash LLP
- Agent Andrew J. Harrington
- Main IPC: G01R1/04
- IPC: G01R1/04 ; B23K37/00 ; B29C65/82
Abstract:
A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.
Public/Granted literature
- US20210018532A1 ENCAPSULATED COMPONENT ATTACHMENT TECHNIQUE USING A UV-CURE CONDUCTIVE ADHESIVE Public/Granted day:2021-01-21
Information query
