公开(公告)号：US11385258B2

公开(公告)日：2022-07-12

申请号：US17062612

申请日：2020-10-04

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell ,  Karl A. Rinder ,  Regina R. Mrozik

IPC: G01R1/04 ,  B23K37/00 ,  B29C65/82

Abstract: A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.

公开(公告)号：US20210018532A1

公开(公告)日：2021-01-21

申请号：US17062612

申请日：2020-10-04

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell ,  Karl A. Rinder ,  Regina R. Mrozik

IPC: G01R1/04 ,  B29C65/82 ,  B23K37/00

Abstract: A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.

公开(公告)号：US10739381B2

公开(公告)日：2020-08-11

申请号：US15978090

申请日：2018-05-11

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell ,  Regina R. Mrozik

IPC: G01R1/04 ,  H05K3/32 ,  G01R1/067 ,  G01R3/00

Abstract: A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.

公开(公告)号：US20180340956A1

公开(公告)日：2018-11-29

申请号：US15978090

申请日：2018-05-11

Applicant: Tektronix, Inc.

Inventor： Julie A. Campbell ,  Regina R. Mrozik

IPC: G01R1/04 ,  G01R3/00 ,  G01R1/067 ,  H05K3/32

CPC classification number: G01R1/0416 ,  G01R1/06755 ,  G01R1/06788 ,  G01R3/00 ,  H05K3/321

Abstract: A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.