Invention Grant
- Patent Title: Camera module including heat dissipating structure and electronic device including the same
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Application No.: US16839534Application Date: 2020-04-03
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Publication No.: US11388276B2Publication Date: 2022-07-12
- Inventor: Jaeyoung Huh , Kyungwan Park , Seunghoon Kang , Boram Kim , Youngjin Kim , Sunghoon Moon , Hongki Moon , Yoonsun Park , Hajoong Yun , Jonghoon Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0039821 20190404
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H04N5/225 ; H05K1/18 ; H05K7/20

Abstract:
An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.
Public/Granted literature
- US20200322467A1 CAMERA MODULE INCLUDING HEAT DISSIPATING STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-10-08
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