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公开(公告)号：US11271610B2
公开(公告)日：2022-03-08
申请号：US17060743
申请日：2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wonjun Jung , Seunghoon Kang , Kiyong Son
Abstract: A switching transformer includes a drive amplifier configured to output an input signal by amplifying a source signal, a primary circuit including a set of primary inductors, a primary switch, and a first primary connecting wire, the set of primary inductors being configured to receive the input signal at a first primary input/output terminal, the primary switch being configured to adjust an inductance of the set of primary inductors based on a first switching operation, and the first primary connecting wire being configured to electrically connect the first primary input/output terminal to an end of the primary switch, and a secondary circuit configured to mutually electrically couple to the first primary connecting wire and at least one primary inductor among the set of primary inductors.
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公开(公告)号：US20200241610A1
公开(公告)日：2020-07-30
申请号：US16774618
申请日：2020-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , H01L23/427
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
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公开(公告)号：US11910516B2
公开(公告)日：2024-02-20
申请号：US17293280
申请日：2019-11-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki Moon , Yoonsun Park , Seunghoon Kang , Kyungha Koo , Seyoung Jang , Woojune Jung
CPC classification number: H05K1/0203 , H05K1/14 , H05K7/20336 , H05K2201/064 , H05K2201/10098
Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
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公开(公告)号：US11714468B2
公开(公告)日：2023-08-01
申请号：US17532518
申请日：2021-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , H01L23/427 , G06F1/16
CPC classification number: G06F1/203 , G06F1/1637 , G06F1/206 , H01L23/427
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
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公开(公告)号：US20190258065A1
公开(公告)日：2019-08-22
申请号：US16279056
申请日：2019-02-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sukjin Yun , Seunghoon Kang , Kyeongsoo Kim , Jaecheon Kim , Hongki Moon , Yoonsun Park , Hyunjin Bai , Jaewook Jeong , Seungbo Hong , Jiseong Hwang
IPC: G02B27/01
Abstract: According to various embodiments, an electronic device includes: a housing including: a first plate; a second plate facing a direction opposite a direction of the first plate; and a sidewall surrounding a first space between the first plate and the second plate, the first space being a sealed space; and at least one electronic component arranged in the first space of the housing, wherein at least a part of the sidewall of the housing includes a moisture induction portion configured to induce moisture in the first space to be generated in a moisture induction region of the moisture induction portion that may be due, for example, to a difference in temperature between the first space and an external environment.
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Patent Agency Ranking
6.发明授权公开(公告)号：US11388276B2
公开(公告)日：2022-07-12
申请号：US16839534
申请日：2020-04-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeyoung Huh , Kyungwan Park , Seunghoon Kang , Boram Kim , Youngjin Kim , Sunghoon Moon , Hongki Moon , Yoonsun Park , Hajoong Yun , Jonghoon Lim
Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.
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公开(公告)号：US20220083110A1
公开(公告)日：2022-03-17
申请号：US17532518
申请日：2021-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , H01L23/427 , G06F1/16
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
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公开(公告)号：US11181955B2
公开(公告)日：2021-11-23
申请号：US16774618
申请日：2020-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , G06F1/16 , H01L23/427
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
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公开(公告)号：US11881612B2
公开(公告)日：2024-01-23
申请号：US17402055
申请日：2021-08-13
Applicant: Samsung Electronics Co., Ltd. , Amotech Co., Ltd.
Inventor： Seunghoon Kang , Jinhyoung Lee , Kyungha Koo , Jinmyoung Kim , Hongki Moon , Yoonsun Park , Seyoung Jang , Seungjae Hwang
Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
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公开(公告)号：US20240008232A1
公开(公告)日：2024-01-04
申请号：US18370143
申请日：2023-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hajoong YUN , Yoonsun Park , Seunghoon Kang , Kyungha Koo , Hongki Moon , Jongkil Park , Yongjae Song
CPC classification number: H05K7/20972 , H05K5/0217 , H04M1/0268
Abstract: An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.
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